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The advent and introduction of new technology always raises questions, a major one being whether the technology behaves as promised. This concern is particularly significant in electronics testing, where even minor deviations from expected performance can result in product failures, safety risks, or costly recalls. New testing methods must be thoroughly validated to ensure they do not unintentionally alter, degrade, or interfere with the functionality of the devices being tested. Without careful verification and control, manufacturers risk adopting tools that compromise the very systems they are intended to protect.
One major promise of Anvil’s RF-based testing technique is that Anvil is non-invasive and non-destructive. This means that Anvil does not physically alter, damage, or interfere with the circuit, either temporarily or permanently. Damage to the tested part can come in different risks:
The introduction of failures refers to situations where the test process itself unintentionally causes damage or latent defects in a device or circuit. These failures may be immediate such as a visibly burnt component, or latent only appearing later during field use, such as weakened solder joints or corrupted firmware. Failures can be introduced through various means, including over-voltage or over-current during electrical testing, mechanical stress from probes or clamps, thermal stress during burn-in or powered tests, radiation exposure (such as X-rays affecting memory or sensors), electrostatic discharge (ESD), or even physical damage from misaligned test equipment.
A clear example of the introduction of failures during electronics testing can be seen with Automated X-ray Inspection (AXI). While AXI is a powerful, non-contact method for detecting hidden defects such as solder voids and misaligned components, it can inadvertently cause damage if not properly controlled. Certain electronic components—such as lithium-based batteries, flash memory, EEPROMs, image sensors, and some analog or MEMS devices—are sensitive to ionizing radiation. Exposure to high doses of X-rays during inspection can degrade internal materials, alter electrical properties, or corrupt stored data. Prior peer-reviewed work inspected electronics and found certain electronic types to be sensitive. To prevent this, AXI systems must be carefully configured with appropriate exposure settings, and components known to be radiation-sensitive should either be shielded or excluded from routine X-ray inspection.
Degradation of electronics due to testing refers to the gradual deterioration of a component's performance, reliability, or physical integrity as a result of the stress or conditions imposed during the testing process. Unlike catastrophic failures, degradation may not cause immediate malfunction but can lead to reduced lifespan, performance drift, or latent failures that appear later in the product's life cycle.
For example, during repeated In-Circuit Testing (ICT), the test probes press down on specific test pads or vias on the printed circuit board (PCB). While each individual test might apply only minimal force, over time, the repeated mechanical contact can cause wear and tear on the pads or even introduce microcracks in solder joints. These microcracks may not affect functionality during testing but can expand during field use due to thermal cycling or vibration, eventually leading to intermittent connections or complete circuit failure. This form of degradation stresses that non-invasive, non-destructive tests are preferred.
When injecting any signal into a testd part during testing, alteration of the state of electronics becomes a concern. Such signal injection is common during functional testing, in-circuit testing (ICT), or boundary scan (JTAG), where external voltages or signals are applied to stimulate and verify circuit behavior. Injecting these signals can unintentionally change the internal state of parts—such as toggling a mode, altering register values, or resetting memory. For example, a signal sent to a microcontroller input might activate a diagnostic mode or overwrite part of its configuration. In complex systems, such interactions can disrupt communication protocols or cause devices to operate incorrectly. If these changes are not reversed after testing, the electronics may exhibit unexpected behavior in the field. Therefore, testing processes must be carefully managed to avoid unintentional alteration, ensuring that all signals are controlled, time-bound, and followed by proper configuration restoration when necessary.
Customers often seek confirmation that Anvil is truly non-invasive and non-destructive. The ability to test as frequently as desired—without risk to the device—is highly appealing, as it enables testing early and often throughout manufacturing and handling, supporting better quality control and traceability.
Initially, Anvil’s non-invasive and non-destructive nature was supported by theoretical foundations and semiconductor physics. The injected signal power remained below the activation threshold of logic gates, and signal injection was carefully sequenced to prevent interference. These principles have been validated by multiple peer-reviewed studies, including those conducted by independent academics using researching similar methods, all reporting similar conclusions.
Now, we’ve taken a major step forward. An independent third party has verified, through its own rigorous testing protocol, that Anvil does not affect the integrity of the part being tested and introduces no defects. The blind test protocol was as follows:
The final verdict: Anvil does not affect the part tested and introduces no defects—a strong, independent confirmation of Anvil’s non-invasive, non-destructive capabilities.
What makes this significant is that the parts were Automotive Safety Integrity Level (ASIL) A. ASIL A parts are rigorously tested, as they must meet strict safety requirements and maintain a failure rate of less than 10^-6 per hour of operation. This means that the testing process of the parts was rigorous, thorough, and highly controlled.